What details should be paid attention to in the process of epoxy board processing?

1. Chip cleaning and cooling problems will occur during the processing. The compressed air blowing flow can be used to reduce the flow rate to just blow off the chips.

2. Epoxy board processing will generate a lot of dust. Of course, you can also choose to operate with water. Therefore, we have to choose to install an industrial vacuum cleaner.

3. During the processing, the temperature may be too high. We must control the temperature at the right time. We know that the base material of epoxy board is epoxy resin glue, and the melting point of epoxy resin glue is about 155 degrees. Above this temperature, the board will soften.

4.Choose the epoxy board that suits you. If you do not require high voltage resistance, you can choose the general 3240 epoxy board. Used for general insulation engineering. If the voltage requirements are very high, you can choose FR4 epoxy board.

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